Decentralized Artificial Intelligence in Distributed Computing and Robotics.

Edge Computing + Distributed AI + Swarm Robotics 

 
 
 
 
 
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ACCESS TO OUR TECHNOLOGY:

Swarm Technology, LLC has teamed up with Phi Robotics Research Pvt. Ltd.

As a result of the partnership, Phi Robotics Research will soon release a Hardware-Software Development Kit (HSDK.) The HSDK will target companies looking to monetize Dynamic Expandable Edge Processing (DEEP) within the realm of IoT.

In addition to the SDK, the Swarm-Phi partnership will release the world’s first Swarm Robotics Development Kit (SRDK.)

The kit will be intended for companies and research institutions looking to innovate in:

Ground and/or Air Reconnaissance Missions

Large Scale Autonomous Agriculture

Amazon-like Distribution Centers

Fleets of Autonomous Vehicles

Autonomous Manufacturing

The beauty of the HSDK is in its versatility, it uses the same API for both Edge Processing and Swarm Robotics.


LICENSE OUR PATENT PORTFOLIO:

Swarm Technology's intellectual property portfolio covers: Distributed Processing, Heterogeneous Processing, Swarm Intelligence, Machine Learning, and Multi-Agent Artificial Intelligence. We are seeking to partner with an established company to quickly build market share and margins for products adopting Swarm Technology’s architecture and algorithms.

Patent Portfolio

U.S. Patent No. 9,146,777 entitled “Parallel Processing With Solidarity Cells by Proactively Retrieving From a Task Pool a Matching Task for the Solidarity Cell to Process” issued on September 29, 2015, and U.S. Patent Application No. 2014/0337850 entitled “System and Method for Parallel Processing Using Dynamically Configurable Proactive Co-Processing Cells,” describe the essence of the Solidarity Cell Architecture.

In addition to United Stated patent coverage, we have patent applications in the following territories:

Patent Cooperation Treaty Application No. PCT/US2015/039993

European Union Patent Office Application No.15825147.0

Japanese Patent Office Application No. 2017-503021

Indian Patent Office Application No. 201747006602

Chinese Patent Office Application No. 201580039190.0

Hong Kong Patent Office Application No.17106684.9

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